 |
数据搜索系统，热门电子元器件搜索 |
|
|
数据搜索系统，热门电子元器件搜索 |
|
TMS320F28069MPZPQ 数据表(PDF) 32 Page - Texas Instruments |
|
|
|
|||||||||||||||||||||||||||||
TMS320F28069MPZPQ 数据表(HTML) 32 Page - Texas Instruments |
|
|
32 / 182 page  32 TMS320F28069, TMS320F28068, TMS320F28067, TMS320F28066 TMS320F28065, TMS320F28064, TMS320F28063, TMS320F28062 SPRS698G – NOVEMBER 2010 – REVISED MAY 2018 www.ti.com Submit Documentation Feedback Product Folder Links: TMS320F28069 TMS320F28068 TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063 TMS320F28062 Specifications Copyright © 2010–2018, Texas Instruments Incorporated (1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements (2) lfm = linear feet per minute 5.7.3 PN Package °C/W(1) AIR FLOW (lfm)(2) RΘJC Junction-to-case thermal resistance 7.9 0 RΘJB Junction-to-board thermal resistance 15.6 0 RΘJA (High k PCB) Junction-to-free air thermal resistance 41.1 0 31.2 150 29.7 250 27.5 500 PsiJT Junction-to-package top 0.4 0 0.6 150 0.7 250 0.9 500 PsiJB Junction-to-board 15.3 0 14.6 150 14.4 250 14.1 500 (1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements (2) lfm = linear feet per minute 5.7.4 PZ Package °C/W(1) AIR FLOW (lfm)(2) RΘJC Junction-to-case thermal resistance 7.2 0 RΘJB Junction-to-board thermal resistance 19.6 0 RΘJA (High k PCB) Junction-to-free air thermal resistance 42.2 0 32.4 150 30.9 250 28.7 500 PsiJT Junction-to-package top 0.4 0 0.6 150 0.7 250 0.9 500 PsiJB Junction-to-board 19.1 0 18.2 150 17.9 250 14.1 500 |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
Chinese ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
