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ACPL-P302 数据表(PDF) 5 Page - Broadcom Corporation. |
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ACPL-P302 数据表(HTML) 5 Page - Broadcom Corporation. |
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5 / 15 page ![]() Broadcom Confidential - 5 - ACPL-P302/ACPL-W302 Data Sheet Insulation and Safety Related Specifications Parameter Symbol ACPL- P302 ACPL- W302 Unit Conditions Minimum External Air Gap (External Clearance) L(101) 7.0 8.0 mm Measured from input terminals to output terminals, shortest distance through air. Minimum External Tracking (External Creepage) L(102) 8.0 8.0 mm Measured from input terminals to output terminals, shortest distance path along body. Minimum Internal Plastic Gap (Internal Clearance) 0.08 0.08 mm Through insulation distance conductor to conductor, usually the straight line distance thickness between the emitter and detector. Minimum Internal Tracking (Internal Creepage) N/A N/A mm Measured from input terminals to output terminals, along internal cavity. Tracking Resistance (Comparative Tracking Index) CTI >175 >175 V DIN IEC 112/VDE 0303 Part 1 Isolation Group IIIa IIIa Material Group (DIN VDE 0110, 1/89, Table 1) Note: All Broadcom data sheets report the creepage and clearance inherent to the optocoupler component itself. These dimensions are needed as a starting point for the equipment designer when determining the circuit insulation requirements. However, once mounted on a printed circuit board, minimum creepage and clearance requirements must be met as specified for individual equipment standards. For creepage, the shortest distance path along the surface of a printed circuit board between the solder fillets of the input and output leads must be considered (the recommended Land Pattern does not necessarily meet the minimum creepage of the device). There are recommended techniques such as grooves and ribs which may be used on a printed circuit board to achieve desired creepage and clearances. Creepage and clearance distances will also change depending on factors such as pollution degree and insulation level. Absolute Maximum Ratings Parameter Symbol Min. Max. Unit Note Storage Temperature TS –55 +125 °C Operating Temperature TA –40 +100 °C Average Input Current IF(AVG) 25 mA 1 Peak Transient Input Current (<1 µs pulse width, 300pps) IF(TRAN) 1.0 A Reverse Input Voltage VR 5 V High Peak Output Current IOH(PEAK) 0.4 A 2 Low Peak Output Current IOL(PEAK) 0.4 A 2 Supply Voltage VCC – VEE –0.5 35 V Output Voltage VO(PEAK) –0.5 VCC V Output Power Dissipation PO 250 mW 3 Input Power Dissipation PI 45 mW 4 Lead Solder Temperature 260°C for 10 sec., 1.6 mm below seating plane Solder Reflow Temperature Profile See Package Outline Drawings section Recommended Operating Conditions Parameter Symbol Min. Max. Unit Note Power Supply VCC – VEE 10 30 V Input Current (ON) IF(ON) 7 12 mA Input Voltage (OFF) VF(OFF) –3.6 0.8 V Operating Temperature TA –40 100 °C |
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