3

IX2R11

Symbol

Definition

Min

Max

Units

V

CH

High side floating supply voltage

-25

650

V

V

HS

High side floating supply offset voltage

V

V

V

V

HGO

High side floating output voltage

V

V

V

V

CL

Low side fixed supply voltage

-0.3

35

V

V

LGO

Low side output voltage

-0.3

V

V

V

DD

Logic supply voltage

-0.3

V

V

V

DG

Logic supply offset voltage

V

V

V

V

IN

Logic input voltage(HIN & LIN)

V

V

V

dV

Allowable offset supply voltage transient

50

V/ns

P

D

Package power dissipation@ T

1.25

W

P

D

Package power dissipation@ T

2.5

W

R

THJA

Thermal resistance, junction-to-ambient

100

K/W

R

THJc

Thermal resistance, junction-to-case

50

K/W

T

J

Junction Temperature

150

o

C

T

S

Storage temperature

-55

150

o

C

T

L

Lead temperature (soldering, 10 s)

300

o

C

Absolute Maximum Ratings

Symbol

Definition

Min

Max

Units

V

CH

High side floating supply absolute voltage V

V

V

V

HS

High side floating supply offset voltage

-20

650

V

V

HGO

High side floating output voltage

V

HS

V

V

V

CL

Low side fixed supply voltage

10

20

V

V

LGO

Low side output voltage

0

V

CC

V

V

DD

Logic supply voltage

V

V

V

V

DG

Logic supply voffset voltage

V

V

V

V

IN

Logic input voltage(HIN, LIN, ENbar)

V

DG

V

DD

V

T

A

Ambient Temperature

-40

125

o

C

Recommended Operating Conditions

Ordering Information

Part Number

Package Type

IX2R11P7

14-PIN DIP

IX2R11S3

16-PIN SOIC