Data Sheet

ADCLK905/ADCLK907/ADCLK925

Rev. B | Page 7 of 16

D1

D1

D2

D2

Q1

Q1

Q2

Q2

12

11

10

1

3

4

9

2

ADCLK907

TOP VIEW

(Not to Scale)

NOTES

1. EXPOSED PAD. THE EXPOSED PAD IS NOT ELECTRICALLY CONNECTED TO ANY PART OF THE CIRCUIT.

IT CAN BE LEFT FLOATING FOR OPTIMAL ELECTRICAL ISOLATION BETWEEN THE PACKAGE HANDLE

AND THE SUBSTRATE OF THE DIE. IT CAN ALSO BE SOLDERED TO THE APPLICATION BOARD IF IMPROVED

THERMAL AND/OR MECHANICAL STABILITY IS DESIRED. EXPOSED METAL AT THE CORNERS OF THE PACKAGE

IS CONNECTED TO THIS EXPOSED PAD. ALLOW SUFFICIENT CLEARANCE TO VIAS AND OTHER COMPONENTS.

Figure 5. ADCLK907 Pin Configuration

Table 5. Pin Function Descriptions for Dual 1:1 ADCLK907 Buffer

Pin No.

Mnemonic

Description

1

D1

Noninverting Input 1.

2

D1

Inverting Input 1.

3

D2

Noninverting Input 2.

4

D2

Inverting Input 2.

5

Center Tap 2. Center tap of 100 Ω input resistor, Channel 2.

6

Reference Voltage 2. Reference voltage for biasing ac-coupled inputs, Channel 2.

7, 14

Negative Supply Voltage.

8, 13

Positive Supply Voltage. Pin 8 and Pin 13 are not strapped internally.

9

Q2

Inverting Output 2.

10

Q2

Noninverting Output 2.

11

Q1

Inverting Output 1.

12

Q1

Noninverting Output 1.

15

Reference Voltage 1. Reference voltage for biasing ac-coupled inputs, Channel 1.

16

Center Tap 1. Center tap of 100 Ω input resistor, Channel 1.

EPAD

Exposed Pad. The exposed pad is not electrically connected to any part of the circuit. It can be left floating for

optimal electrical isolation between the package handle and the substrate of the die. It can also be soldered to

the application board if improved thermal and/or mechanical stability is desired. Exposed metal at the corners

of the package is connected to this exposed pad. Allow sufficient clearance to vias and other components.