ADCLK905/ADCLK907/ADCLK925

Data Sheet

Rev. B | Page 8 of 16

D

D

NC

NC

Q1

Q1

Q2

Q2

12

11

10

1

3

4

9

2

ADCLK925

TOP VIEW

(Not to Scale)

NOTES

1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN.

2. EXPOSED PAD. THE EXPOSED PAD IS NOT ELECTRICALLY CONNECTED TO ANY PART OF THE CIRCUIT.

IT CAN BE LEFT FLOATING FOR OPTIMAL ELECTRICAL ISOLATION BETWEEN THE PACKAGE HANDLE

AND THE SUBSTRATE OF THE DIE. IT CAN ALSO BE SOLDERED TO THE APPLICATION BOARD IF IMPROVED

THERMAL AND/OR MECHANICAL STABILITY IS DESIRED. EXPOSED METAL AT THE CORNERS OF THE PACKAGE

IS CONNECTED TO THIS EXPOSED PAD. ALLOW SUFFICIENT CLEARANCE TO VIAS AND OTHER COMPONENTS.

Figure 6. ADCLK925 Pin Configuration

Table 6. Pin Function Descriptions for 1:2 ADCLK925 Buffer

Pin No.

Mnemonic

Description

1

D

Noninverting Input.

2

D

Inverting Input.

3, 4, 5, 6

NC

No Connect. No physical connection to the die.

7, 14

Negative Supply Voltage.

8, 13

Positive Supply Voltage.

9

Q2

Inverting Output 2.

10

Q2

Noninverting Output 2.

11

Q1

Inverting Output 1.

12

Q1

Noninverting Output 1.

15

Reference Voltage. Reference voltage for biasing ac-coupled inputs.

16

Center Tap. Center tap of 100 Ω input resistor.

EPAD

Exposed Pad. The exposed pad is not electrically connected to any part of the circuit. It can be left floating for

optimal electrical isolation between the package handle and the substrate of the die. It can also be soldered to

the application board if improved thermal and/or mechanical stability is desired. Exposed metal at the corners

of the package is connected to this exposed pad. Allow sufficient clearance to vias and other components.