CPC7524

14

www.ixysic.com

R02

4. Manufacturing Information

4.1 Moisture Sensitivity

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated

Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest

version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation.

We test all of our products to the maximum conditions set forth in the standard, and guarantee proper

operation of our devices when handled according to the limitations and information in that standard as well as to any

limitations set forth in the information or standards referenced below.

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced

product performance, reduction of operable life, and/or reduction of overall reliability.

This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled

according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.

4.2 ESD Sensitivity

This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

4.3 Reflow Profile

Temperature allowed for this device during lead-free reflow processes. For through hole devices, and any other

processes, the guidelines of J-STD-020 must be observed.

4.4 Board Wash

IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or

remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to

prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and

providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing

process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature

and duration necessary to remove the moisture trapped within the package is the responsibility of the user

(assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be

used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.

Device

Moisture Sensitivity Level (MSL) Classification

CPC7524B

MSL 3

Device

Max Reflow Cycles

CPC7524B

260°C

30 seconds

3