5

IXDR502 / IXDS502

Pin Description

Figure 3 - Characteristics Test Diagram

CAUTION: Follow proper ESD procedures when handling and assembling this component.

1

2

3

4

5

6

IN

GND

Vcc

OUT

GND

GND

10uF

Vcc

1000 pF

Agilent 1147A

Current Probe

0.01uF

PIN NUMBER

SYMBOL

FUNCTION

DESCRIPTION

1

IN

Signal Input

Input signal-TTL or CMOS compatible.

2

Vcc

Supply Voltage

Positive power supply voltage input. This pin provides power to the

entire chip. The range for this voltage is from 4.5V to 25V.

3

OUT

Drive Output

Driver output. For application purposes, this pin is connected via a

resistor to the gate of a MOSFET or IGBT.

4,5,6

GND

Ground

The drivers ground pins. Internally connected to all circuitry, these

pins provide ground reference for the entire device. These pins

should be connected to a low noise analog ground plane for

optimum performance.

IXYS reserves the right to change limits, test conditions, and dimensions.

IXDS 6 Lead DFN (D1B)

(Bottom View)

NOTE: Solder tabs on bottoms of DFN packages are grounded

5

6

4

3

2

1

GND

GND

GND

IN

OUT

Vcc

5

6

4

3

2

1

GND

GND

GND

IN

OUT

Vcc

IXDR 6 Lead DFN (D1B)

(Bottom View)

Pin Configuration