NICHIA STS-DA1-4024G <Cat.No.180911>

6

* This LED uses glass for the phosphor sheet (i.e. emitting surface); if excess pressure is applied to the glass, it may cause the glass

to be damaged, chipped, cracked and/or deformed. If the glass is damaged, chipped, cracked and/or deformed, it may cause the

internal connection to fail causing a catastrophic failure (i.e. the LED not to illuminate) and/or reliability issues (e.g. the LED to

corrode and/or to become dimmer, the color/directivity to change, etc.).

Recommended conditions:

Using a nozzle specifically designed for the LEDs is recommended (See the nozzle drawing below).

Nozzle contact area:

The center of the phosphor sheet (See the second figure from the right)

(単位 Unit: mm)

1.2

0.4

2.2

R0.1

If the nozzle is off-center and makes contact with the edges of the phosphor sheet (as shown in the figure to the right), it may

cause the glass to chip/crack.

* Once the LEDs have been soldered to a PCB, it should not be repaired/reworked. If it must be done, using a hot plate is strongly

recommended. Sufficient verification should be performed prior to use to ensure that the repair/rework does not cause the LED

characteristics to deteriorate.

* When soldering, do not apply stress to the LED while the LED is hot.

* When using a pick and place machine, choose an appropriate nozzle for this product.

* The soldering pad pattern above is a general recommendation for LEDs to be mounted without issues; if a high degree of precision

is required for the chosen application (i.e. high-density mounting), ensure that the soldering pad pattern is optimized.

* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner where the

flux will come in contact with the LEDs.

* Ensure that there are no issues with the type and amount of solder that is being used.

* This LED has all the electrodes on the backside; solder connections will not be able to be seen nor confirmed by a normal visual

inspection. Ensure that sufficient verification is performed on the soldering conditions prior to use to ensure that there are no

issues.