NICHIA STS-DA1-4024G <Cat.No.180911>

16

(3) Handling Precautions

● Do not handle the LEDs with bare hands as it will contaminate the LED surface and may affect the optical characteristics: it might

cause the LED to be deformed and/or the bump to break, which will cause the LED not to illuminate.

● Ensure that when handling the LEDs with tweezers, excessive force is not applied to the LED. Otherwise, it may cause damage to

the resin (e.g. cut, scratch, chip, crack, delamination and deformation) and the internal connection to fail causing a catastrophic

failure (i.e. the LED not to illuminate).

● Dropping may cause damage to the LED (e.g. deformation).

● Do not stack assembled PCBs together. Otherwise, it may cause damage to the resin (e.g. cut, scratch, chip, crack, delamination

and deformation) and the internal connection to fail causing a catastrophic failure (i.e. the LED not to illuminate).

(4) Design Consideration

● If the LEDs are soldered to a PCB and the PCB assembly is bent (e.g. PCB depaneling process), it may cause the LED package to

break. The PCB layout should be designed to minimize the mechanical stress on the LEDs when the PCB assembly is bent/warped.

● The amount of mechanical stress exerted on the LED from depaneling may vary depending on the LED position/orientation on the

PCB assembly (e.g. especially in areas near V-groove scores). The PCB layout should be designed to minimize the mechanical

stress on the LEDs when the PCB is separated into individual PCB assemblies.

● To separate a PCB populated with the LEDs, use a specially designed tool. Do not break the PCB by hand.

● Volatile organic compounds that have been released from materials present around the LEDs (e.g. housing, gasket/seal, adhesive,

secondary lens, lens cover, etc.) may penetrate the LED lens and/or encapsulating resin. If the LEDs are being used in a

hermetically sealed environment, these volatile compounds can discolor after being exposed to heat and/or photon energy and

it may greatly reduce the LED light output and/or color shift. In this case, ventilating the environment may improve the reduction

in light output and/or color shift. Perform a light-up test of the chosen application for optical evaluation to ensure that there are

no issues, especially if the LEDs are planned to be used in a hermetically sealed environment.

● If an aluminum-core PCB is used to operate the LEDs, it may cause thermal stress during operation causing damage to the solder

joints (e.g. crack). Ensure that sufficient verification is performed prior to use. Nichia recommends using an aluminum-core PCB

with a low elastic modulus insulating layer.

● Ensure that the chosen soldering pad pattern has a solder mask which does not cover the copper pads that the LED will be

attached to or the area underneath the LED.

(Non Solder Mask Defined [NSMD] pads are recommended; see the figure below.)

基材

Base Material

基材

Base Material

NSMD(推奨 Recommended)

SMD(参考 Reference)

ソルダーレジスト

Solder Mask

ソルダーレジスト

Solder Mask

銅箔パッド

Copper Pad

銅箔パッド

Copper Pad

製品

LED

はんだペースト

Solder Paste

はんだペースト

Solder Paste

製品

LED