| 数据搜索系统,热门电子元器件搜索 |
|
106963 数据表(PDF) 2 Page - PHOENIX CONTACT |
|
|
|||||||||||||||||||||||||||||
106963 数据表(HTML) 2 Page - PHOENIX CONTACT |
|
2 / 25 page ![]() TRIO-PS-2G/1AC/12DC/5/C2LPS 106963_en_00 PHOENIX CONTACT 2 / 25 2Table of contents 1 Description ..................................................................................................................................1 2 Table of contents .........................................................................................................................2 3 Ordering data ..............................................................................................................................4 4 Technical data .............................................................................................................................5 5 Safety regulations and installation notes ................................................................................... 11 6 High-voltage test (HIPOT) ......................................................................................................... 12 6.1 High-voltage dielectric test (dielectric strength test) and why must it be performed? .................................... 12 6.2 High-voltage dielectric test during the manufacturing process...................................................................... 12 6.3 High-voltage dielectric test performed by the customer ................................................................................ 12 6.4 Performing high-voltage testing .................................................................................................................... 12 7 Basic circuit diagram ................................................................................................................. 13 8Structure .................................................................................................................................................................13 9 Cooling ...................................................................................................................................... 14 10 Mounting position and dimensions ............................................................................................ 14 10.1 Mounting position ......................................................................................................................................... 14 10.2 Device dimensions ....................................................................................................................................... 15 11 Mounting/removal...................................................................................................................... 16 11.1 Assembly ...................................................................................................................................................... 16 11.2 Removal ....................................................................................................................................................... 16 12 Device connection terminal blocks .................................................................................................................16 12.1 Push-in connection technology ..................................................................................................................... 16 13 Input .......................................................................................................................................... 17 13.1 Position of input terminals ............................................................................................................................. 17 13.2 Protection of the primary side ....................................................................................................................... 17 14 Output ....................................................................................................................................... 18 14.1 Position of output terminals........................................................................................................................... 18 14.2 Protection of the secondary side................................................................................................................... 18 14.3 Output characteristic curve ........................................................................................................................... 18 14.4 Meaning of NEC - Class 2 (National Electrical Code - Class 2) .................................................................... 19 15 Signaling .................................................................................................................................................................19 15.1 DC OK-LED .................................................................................................................................................. 19 15.2 Floating signal contact .................................................................................................................................. 19 |
|
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |