SSM2305

Data Sheet

Rev. B | Page 14 of 16

OUTLINE DIMENSIONS

TOP VIEW

8

1

5

4

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.55

1.45

1.35

1.84

1.74

1.64

0.203 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-229-WEED

PIN 1

INDICATOR

(R 0.15)

Figure 35. 8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-8-13)

Dimensions shown in millimeters

COMPLIANT TO JEDEC STANDARDS MO-187-AA

0.80

0.60

0.40

8°

0°

4

8

1

5

PIN 1

0.65 BSC

SEATING

PLANE

0.38

0.22

1.10 MAX

3.20

3.00

2.80

COPLANARITY

0.10

0.23

0.08

3.20

3.00

2.80

5.15

4.90

4.65

0.15

0.00

0.95

0.85

0.75

Figure 36. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

Branding

SSM2305CPZ-R2

−40°C to +85°C

8-Lead Lead Frame Chip Scale Package [LFCSP]

CP-8-13

Y10

SSM2305CPZ-REEL

−40°C to +85°C

8-Lead Lead Frame Chip Scale Package [LFCSP]

CP-8-13

Y10

SSM2305CPZ-REEL7

−40°C to +85°C

8-Lead Lead Frame Chip Scale Package [LFCSP]

CP-8-13

Y10

SSM2305RMZ-R2

−40°C to +85°C

8-Lead Mini Small Outline Package [MSOP]

RM-8

Y10

SSM2305RMZ-REEL

−40°C to +85°C

8-Lead Mini Small Outline Package [MSOP]

RM-8

Y10

SSM2305RMZ-REEL7

−40°C to +85°C

8-Lead Mini Small Outline Package [MSOP]

RM-8

Y10

SSM2305-EVALZ

Evaluation Board with LFCSP Model

1

Z = RoHS Compliant Part.