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AP6502 数据表(PDF) 3 Page - Diodes Incorporated |
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AP6502 数据表(HTML) 3 Page - Diodes Incorporated |
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3 / 14 page ![]() AP6502 Document Number: DS35423 Rev. 10 - 2 3 of 14 www.diodes.com May 2017 © Diodes Incorporated AP6502 Absolute Maximum Ratings (Note 4) (@TA = +25°C, unless otherwise specified.) Symbol Parameter Rating Unit VIN Supply Voltage -0.3 to +20 V VSW Switch Node Voltage -1.0 to VIN +0.3 V VBST Bootstrap Voltage VSW -0.3 to VSW +6 V VFB Feedback Voltage -0.3 to +6 V VEN Enable/UVLO Voltage -0.3 to +6 V VCOMP Comp Voltage -0.3 to +6 V TST Storage Temperature -65 to +150 °C TJ Junction Temperature +150 °C TL Lead Temperature +260 °C ESD Susceptibility (Note 5) HBM Human Body Model 3 kV MM Machine Model 250 V Notes: 4. Stresses greater than the 'Absolute Maximum Ratings' specified above may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. 5. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices. Thermal Resistance (Note 6) (@TA = +25°C, unless otherwise specified.) Symbol Parameter Rating Unit θJA Junction to Ambient SO-8EP 74 °C/W θJC Junction to Case SO-8EP 16 Note: 6. Test condition: SO-8EP: Device mounted on 1" x 1" FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane. Recommended Operating Conditions (Note 7) (@TA = +25°C, unless otherwise specified.) Symbol Parameter Min Max Unit VIN Supply Voltage 4.7 18 V TA Operating Ambient Temperature Range -40 +85 °C Note: 7. The device function is not guaranteed outside of the recommended operating conditions. |
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