uS5501

7

uS5501-DS-F0003, Apr. 2012

www.upi-semi.com

Note

1.Package Outline Unit Description:

BSC: Basic. Represents theoretical exact dimension or dimension target

MIN: Minimum dimension specified.

MAX: Maximum dimension specified.

REF: Reference. Represents dimension for reference use only. This value is not a device specification.

TYP. Typical. Provided as a general value. This value is not a device specification.

2.Dimensions in Millimeters.

3.Drawing not to scale.

4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm.

WDFN2x2-8L Package

Package Information

1

4

58

Recommended Solder Pitch and Dimensions

0.18 - 0.30

0.50 BSC

1.90 - 2.10

0.20 - 0.50

1.10 - 1.40

0.00 - 0.05

0.20 REF

1.10 - 1.40

0.18 - 0.30

0.50 BSC

0.70 - 0.80