uS5501

8

uS5501-DS-F0003, Apr. 2012

www.upi-semi.com

Note

1.Package Outline Unit Description:

BSC: Basic. Represents theoretical exact dimension or dimension target

MIN: Minimum dimension specified.

MAX: Maximum dimension specified.

REF: Reference. Represents dimension for reference use only. This value is not a device specification.

TYP. Typical. Provided as a general value. This value is not a device specification.

2.Dimensions in Millimeters.

3.Drawing not to scale.

4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm.

Package Information

SOT23-8L Package

0 .22 - 0.38

2.8 0 - 3.00

1.9 5 BSC

0 .00 - 0.15

0.65 BSC

Recommended Solder Pad Layout

1.45 MAX

0.08 - 0.22

0.3 0 - 0.60

0.45 ± 0.05

0.65 ± 0.05