SEMICONDUCTOR

RoHS

0

4

8

12

16

20

24

28

32

36

40

0

10

20

30

40

50

60

70

80

Fig.11 D²PAK thermal resistance junction to ambient versus

copper surface under tab (printed circuit FR4, copper

thickness: 35µm

Case Style

2.87 (0.113)

2.62 (0.103)

9.40 (0.370)

9.14 (0.360)

10.54 (0.415) MAX.

16.13 (0.635)

15.87 (0.625)

PIN

4.06 (0.160)

3.56 (0.140)

1.45 (0.057)

1.14 (0.045)

2.67 (0.105)

2.41 (0.095)

2.65 (0.104)

2.45 (0.096)

5.20 (0.205)

4.95 (0.195)

0.90 (0.035)

0.70 (0.028)

3.91 (0.154)

3.74 (0.148)

1

3

2

4.70 (0.185)

4.44 0.1754

(

)

1.39 (0.055)

1.14 (0.045)

3.68 (0.145)

3.43 (0.135)

8.89 (0.350)

8.38 (0.330)

29.16 (1.148)

28.40 (1.118)

14.22 (0.560)

13.46 (0.530)

0.56 (0.022)

0.36 (0.014)

2.79 (0.110)

2.54 (0.100)

15.32 (0.603)

14.55 (0.573)

TO-220AB

2

TO-263(D PAK)

2.79 (0.110)

0.36 (0.014)

2.79 (0.110)

2.29 (0.090)

1.40 (0.055)

1.19 (0.047)

0 to 0.254 (0 to 0.01)

1.40 (0.055)

1.14 (0.045)

4.83 (0.190)

4.06 (0.160)

10.45 (0.411)

9.65 (0.380)

6.22 (0.245)

9.14 (0.360)

8.13 (0.320)

15.00 (0.591)

0.940 (0.037)

0.686 (0.027)

2.67 (0.105)

2.41 (0.095)

5.20 (0.205)

4.95 (0.195)

15.85 (0.624)

3.56 (0.140)

0.53 (0.021)

www.nellsemi.com

Page 6 of 7

S(cm²)

D²PAK

2(A2)

3(G)

1(A1)