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OPA2356-EP

SBOS955 – FEBRUARY 2019

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should

be current limited to 10 mA or less.

(3)

Short-circuit to ground one amplifier per package.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage, V+ to V–

7.5

V

(V–) – 0.5

(V+) + 0.5

V

10

mA

Continuous

Operating temperature

–55

150

°C

Junction temperature

160

°C

Storage temperature

–65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged-device model (CDM), per AEC Q100-011

±1500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage, V– to V+

2.7

5.5

V

Operating free-air temperature

–55

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

OPA2356-EP

UNIT

DGK (VSSOP)

8 PINS

Junction-to-ambient thermal resistance

171.4

°C/W

60.2

°C/W

Junction-to-board thermal resistance

92.5

°C/W

Junction-to-top characterization parameter

7.3

°C/W

Junction-to-board characterization parameter

90.9

°C/W