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TPS16632 数据表(PDF) 22 Page - Texas Instruments |
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TPS16632 数据表(HTML) 22 Page - Texas Instruments |
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22 / 42 page ![]() IMON VIN VOUT IIN 22 TPS1663 SLVSET9C – SEPTEMBER 2018 – REVISED MARCH 2019 www.ti.com Product Folder Links: TPS1663 Submit Documentation Feedback Copyright © 2018–2019, Texas Instruments Incorporated Feature Description (continued) Figure 26. IMON Response During a Load Step The IMON pin must not have a bypass capacitor to avoid delay in the current monitoring information. 9.3.7 FAULT Response (FLT) The FLT open-drain output asserts (active low) under the faults events such as undervoltage, overvoltage, overload, power limiting, ILIM pin short and thermal shutdown conditions. The device is designed to eliminate false reporting by using an internal "de-glitch" circuit for fault conditions without the need for an external circuitry. FLT can be left open or connected to GND when not used. 9.3.8 Power Good Output (PGOOD) The devices feature an open drain Power good (PGOOD) indicator output. PGOOD can be used for enable- disable control of the downstream loads like DC-DC converters. PGOOD goes high when the internal FET’s gate is enhanced. It goes low when the internal FET turns OFF during a fault event or when SHDN is pulled low. There is a deglitch of 11.5 msec (typical), tPGOODR at the rising edge and 10 msec (typical), tPGOODF on falling edge. PGOOD is a rated for 60 V and can be pulled to IN or OUT through a resistor. 9.3.9 IN, P_IN, OUT and GND Pins Connect a minimum of 0.1-µF capacitor across IN and GND. Connect P_IN and IN together. Do not leave any of the IN and OUT pins un-connected. 9.3.10 Thermal Shutdown The device has a built-in overtemperature shutdown circuitry designed to protect the internal FET, if the junction temperature exceeds T(TSD), 165°C (typical). After the thermal shutdown event, depending upon the mode of fault response configured as shown inTable 1, the device either latches off or commences an auto-retry cycle of 648 msec (typical), t(TSD_retry) after TJ < [T(TSD) – 11°C]. During the thermal shutdown, the fault pin FLT pulls low to indicate a fault condition. 9.3.11 Low Current Shutdown Control (SHDN) The internal and the external FET and hence the load current can be switched off by pulling the SHDN pin below 0.8-V threshold with a micro-controller GPIO pin or can be controlled remotely with an opto-isolator device. The device quiescent current reduces to 21 μA (typical) in shutdown state. To assert SHDN low, the pull down must have sinking capability of at least 10 µA. To enable the device, SHDN must be pulled up to atleast 2 V. Once the device is enabled, the internal FET turns on with dVdT mode.Figure 27 and Figure 28 illustrate the performance of SHDN control. |
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