SM7312DHKP

Copyright © Sinopower Semiconductor Inc.

Rev. A.1 - January, 2019

www.sinopowersemi.com

11

Classification Reflow Profiles

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Preheat & Soak

100 °C

150 °C

60-120 seconds

150 °C

200 °C

60-120 seconds

Average ramp-up rate

3 °C/second max.

3°C/second max.

183 °C

60-150 seconds

217 °C

60-150 seconds

See Classification Temp in table 1

See Classification Temp in table 2

20** seconds

30** seconds

6 °C/second max.

6 °C/second max.

Time 25°C to peak temperature

6 minutes max.

8 minutes max.

Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)

Package

Thickness

<350

≥350

<2.5 mm

235 °C

220 °C

≥

2.5 mm

220 °C

220 °C

Table 2. Pb-free Process – Classification Temperatures (Tc)

Package

Thickness

<350

350-2000

>2000

<1.6 mm

260 °C

260 °C

260 °C

1.6 mm – 2.5 mm

260 °C

250 °C

245 °C

≥

2.5 mm

250 °C

245 °C

245 °C

Reliability Test Program

Test item

Method

Description

SOLDERABILITY

JESD-22, B102

5 Sec, 245°C

HTRB

JESD-22, A108

1000 Hrs, 80% of VDS max @ Tjmax

HTGB

JESD-22, A108

1000 Hrs, 100% of VGS max @ Tjmax

PCT

JESD-22, A102

168 Hrs, 100%RH, 2atm, 121°C

TCT

JESD-22, A104

500 Cycles, -65°C~150°C

Customer Service

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Hsinchu, 30078, Taiwan

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