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STP16CL596 数据表(PDF) 3 Page - STMicroelectronics |
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STP16CL596 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 18 page ![]() STP16CL596 3/18 Table 4: Absolute Maximum Ratings Absolute Maximum Ratings are those values beyond which damage to the device may occur. Under these conditions, functional operation is not implied. Table 5: Thermal Data (*) The exposed pad should be soldered directly to the PCB to realize the thermal benefits. Table 6: Recommended Operating Conditions Symbol Parameter Value Unit VDD Supply Voltage 0 to 7 V VO Output Voltage -0.5 to 16 V IO Output Current 90 mA VI Input Voltage -0.4 to VDD+0.4 V IGND GND Terminal Current 1440 mA fCLK Clock Frequency 25 MHz TOPR Operating Temperature Range -40 to +125 °C TSTG Storage Temperature Range -65 to +150 °C Symbol Parameter DIP-24 SO-24 TSSOP24 TSSOP24 (*) (exposed pad) Unit Rthj-amb Thermal Resistance Junction-ambient 60 75 85 37.5 °C/W Symbol Parameter Test Conditions Min. Typ. Max. Unit VDD Supply Voltage 3.0 3.3 3.6 V VO Output Voltage 16.0 V IO Output Current OUTn 5 90 mA IOH Output Current SERIAL-OUT +1 mA IOL Output Current SERIAL-OUT -1 mA VIH Input Voltage 0.7VDD VDD+0.3 V VIL Input Voltage -0.3 0.3VDD V twLAT /LE Pulse Width VDD = 3.0 to 3.6V 20 ns twCLK CLK Pulse Width 20 ns twEN /OE Pulse Width 400 ns tSETUP(D) Setup Time for DATA 20 ns tHOLD(D) Hold Time for DATA 15 ns tSETUP(L) Setup Time for LATCH 15 ns fCLK Clock Frequency Cascade Operation 25 MHz |
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