Maximized throughput

The DFD63400 features a facing dual-spindle configuration with a

shorter distance between blades, which improves throughput by up to

30 % for step/bevel cut and 40 % for dual cut when compared with

parallel dual spindle dicing saws.

Small footprint

By employing a new high-rigidity, bridge-type frame structure, the

DFD6340 has the smallest footprint of any 8" saw in its class.

Lower air and energy consumption

Utilizing the latest in conservation technology, the energy and air

consumption of the DFD6340 has been reduced by 33 % and 24 %

respectively when compared to the previous generation of saws.

Consistent cut quality

The DFD6340 offers consistent cut quality with the adoption of a

nozzle cleaning mechanism can also be included in the spinner unit as

an option to effectively clean wafers after dicing (Patent no. 3410385).

DFD6340

Standard dual spindle dicing saw

Fully Automatic Dicing Saw

Cost of ownership improvements

 Shorter set up time - two NCS sensors

Two Non-Contact Setup sensors, one each for Z1 & Z2, enables increased

throughput.

 Shorter kerf check time - two microscopes

A dedicated high-magnification microscope for each spindle allows for

simultaneous kerf checking for increased throughput.

Minimized X axis

movement