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INMP621ACEZ-R0 数据表(PDF) 16 Page - TDK Electronics |
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INMP621ACEZ-R0 数据表(HTML) 16 Page - TDK Electronics |
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16 / 20 page ![]() INMP621 PCB DESIGN AND LAND PATTERN LAYOUT The response of the INMP621 is not affected by the PCB hole size as long as the hole is not smaller than the sound port of the microphone (0.25 mm, or 0.010 inch, in diameter). A 0.5 mm to 1 mm (0.020 inch to 0.040 inch) diameter for the hole is recommended. Take care to align the hole in the microphone package with the hole in the PCB. The exact degree of the alignment does not affect the microphone performance as long as the holes are not partially or completely blocked. Dimensions shown in millimeters Figure 16. Recommended PCB Land Pattern Layout Dimensions shown in millimeters Figure 17. Suggested Solder Paste Stencil Pattern Layout 0.40 × 0.60 (4×) (0.30) 0.90 (0.30) ø1.70 3.80 (0.30) 0.35 2.80 2× R0.10 (0.30) 0.35 2.05 0.70 ø1.10 (1.000) (0.550) CENTER LINE 1.45 0.9 2.45 0.7 1.525 1.000 0.35 1.849 1.849 1.498 0.205 WIDE 0.248 × 0.498 (2×) 0.248 × 1.148 (2×) 0.248 × 0.948 (2×) 1.498 × 0.248 0.398 × 0.298 (4×) 0.362 CUT (3×) 1.17 24° 24° 0.375 CENTER LINE Page 16 of 20 Document Number: DS-INMP621-00 Revision: 1.0 Rev Date: 02/06/2014 |
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