2

Technical Data 10649

Effective July 2018

MPI25-V2

High current, low profile, miniature power inductors

www.eaton.com/electronics

Dimensions (mm)

Product specifications

(μH) ±20%

I

rms

2

(A)

I

sat

3

(A)

DCR (mΩ)

typical @ +20 °C

DCR (mΩ)

maximum @ +20 °C

SRF

(MHz)

typical

1.0 mm height

MPI2510V2-R33-R

0.33

4.8

6.6

15

20

120

6336

MPI2510V2-R47-R

0.47

4.4

6.0

19

25

100

5039

MPI2510V2-R68-R

0.68

3.1

4.3

37

44

80

5733

MPI2510V2-1R0-R

1.00

3.1

4.3

41

52

55

3372

MPI2510V2-1R5-R

1.50

2.5

2.5

65

85

45

4695

MPI2510V2-2R2-R

2.20

2.1

2.8

88

110

45

2873

MPI2510V2-3R3-R

3.30

1.6

2.1

140

170

35

1893

MPI2510V2-4R7-R

4.70

1.22

1.8

220

262

25

1616

1.2 mm height

MPI2512V2-R33-R

0.33

5.1

7.5

14

19

130

6560

MPI2512V2-R47-R

0.47

4.9

6.7

17

23

100

3628

MPI2512V2-R68-R

0.68

3.4

6.0

29

35

70

3633

MPI2512V2-1R0-R

1.00

3.3

4.4

36

44

70

3083

MPI2512V2-1R5-R

1.50

2.3

3.2

64

77

45

4850

MPI2512V2-2R2-R

2.20

2.2

3.5

73

87

30

2924

MPI2512V2-3R3-R

3.30

1.8

2.8

110

135

35

1965

MPI2512V2-4R7-R

4.70

1.4

1.9

196

235

25

1580

1. Open Circuit Inductance (OCL) Test Parameters: 1.0 MHz, 0.1 Vrms, 0.0 Adc, +25 °C.

2. I

necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of

other heat generating components will affect the temperature rise. It is recommended that the

temperature of the part not exceed +125 °C under worst case operating conditions verified in the

end application.

3. I

4. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p :(Gauss),

K: (K-factor from table), L: (Inductance in uH), ΔI (Peak to peak ripple current in Amps).

5. Part Number Definition: MPI25xxV2-xxx-R

MPI25 = Product code

xx= Height indicator

V2=Version indicator

xxx= inductance value in μH, R= decimal point, If no R is present then last character equals

number of zeros

-R suffix = RoHS compliant

Dimension A

MPI2510V2

1.05 maximum

MPI2512V2

1.25 maximum,

No marking

All soldering surfaces to be coplanar within 0.10 millimeters

Tolerances are ±0.2 millimeters unless stated otherwise

Pad layout tolerances are ±0.1 millimeters unless stated otherwise

Do not route traces or vias underneath the inductor