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CLM4B-RKC 数据表(PDF) 8 Page - Cree, Inc |
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CLM4B-RKC 数据表(HTML) 8 Page - Cree, Inc |
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8 / 10 page ![]() Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 8 Copyright © 2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc. 8 Cree PLCC4 1 in 1 SMD LED CLM4B-RKC/AKC REFLOW SOLDERING • The CLM4B-RKC AKC is rated as a MSL 5a product. • Therecommendedfloorlifeoutofbagis24hrs. • Thetemperatureprofileisasbelow. Use only with CLM4B-RKC AKC Solder Average ramp-up rate = 4ºC/s max Preheat temperature = 150ºC ~200ºC Preheat time = 120s max Ramp-down rate = 6ºC/s max Peak temperature = 235ºC max Time within 5ºC of actual Peak Temperature = 10s max Duration above 217ºC is 45s max Document No.: COTCO-05-0057 Rev. NO. : 13 6/9 Melting-point Pre-heat Soak Reflow Cooling Time Use all SMD besides LP6-NPP1-01-N1 Solder = Sn63-Pb37 Solder = Lead-free Average ramp-up rate = 4ºC/s max. Average ramp-up rate = 4ºC/s max Preheat temperature = 100ºC ~150ºC Preheat temperature = 150ºC ~200ºC Preheat time = 100s max. Preheat time = 100s max. Ramp-down rate = 6ºC/s max. Ramp-down rate = 6ºC/s max. Peak temperature = 230ºC max. Peak temperature = 250ºC max. Time within 5ºC of actual Peak Temperature = 10s max. Time within 5ºC of actual Peak Temperature = 10s max. Duration above 183ºC is 80s max. Duration above 217ºC is 80s max. Only use LP6-NPP1-01-N1 [13] Solder = Low Lead-free Average ramp-up rate = 3ºC/s max. Preheat temperature = 130ºC ~170ºC Preheat time = 120s max. Ramp-down rate = 6ºC/s max. Peak temperature = 213ºC max. Time within 3ºC of actual Peak Temperature = 25s max. Duration above 200ºC is 40s max. Recommended solder pad design for heat dissipation (2-pin SMD LED): 7.0 2.6 Recommended solder pad design for heat dissipation (4-pin SMD LED) Referto"http://www.cree.com/led-components/media/documents/sh-HB.pdf"forsoldering&handlingdetails. |
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