P9225-R Datasheet

© 2018 Integrated Device Technology, Inc.

9

November 12, 2018

4. Thermal Characteristics

Table 4.

Package Thermal Information

Note: This thermal rating was calculated on a JEDEC 51 standard 4-layer board with dimensions 76.2 x 114.3 mm in still-air conditions.

Symbol

Description

WLCSP Rating 8 Thermal Balls

Units

Thermal Resistance, Junction to Ambient[a]

47

°

C/W

Thermal Resistance, Junction to Case

0.202

°

C/W

Thermal Resistance, Junction to Board

4.36

°

C/W

Operating Junction Temperature[a]

-5 to +125

°

C

Ambient Operating Temperature[a]

0 to +85

°

C

Storage Temperature

-55 to +150

°

C

Maximum Soldering Temperature (Reflow, Pb-Free)

260

°

C

will result in excessive die temperature, and the device will enter thermal shutdown.

5. Electrical Characteristics

Table 5.

Electrical Characteristics

Note: See important table notes at the end of this table.

Symbol

Description

Conditions

Minimum

Typical

Maximum

Units

Under-Voltage Lock-Out (UVLO)

UVLO Rising

Rising voltage on VRECT

2.9

2.98

V

UVLO Hysteresis

VRECT falling

200

mV

Over-Voltage Protection

DC Over-Voltage Protection

Rising voltage on VRECT

12

V

Over-Voltage Hysteresis

1

V

Quiescent Current

Supply Current

EN

¯¯ = LOW, No load; VRECT = 5.5V

3.0

mA

Shut Down Mode Current

EN

¯¯ = HIGH, VRECT = 5.5V

500

μA

VDD18 Voltage

1.62

1.8

1.98

V

VDD5V Voltage

4.5

5

5.5

V