VLRK31R1S2, VLRK31Q1R2

www.vishay.com

Vishay Semiconductors

Rev. 1.5, 13-Aug-2018

6

Document Number: 81778

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

REEL DIMENSIONS in millimeters

SOLDERING PROFILE

Fig. 9 - Vishay Lead (Pb)-free Reflow Soldering Profile

(according to J-STD-020C)

Fig. 10 - Double Wave Soldering of Opto Devices (all Packages)

21067

0

50

100

150

200

250

300

0

50

100

150

200

250

300

Time (s)

240 °C

245 °C

max. 260 °C

max. 120 s

max. 100 s

217 °C

max. 30 s

max. ramp up 3 °C/s

max. ramp down 6 °C/s

19885

IR Reflow Soldering Profile for Lead (Pb)-Free Soldering

Preconditioning according to JEDEC level 2a

max. 2 cycles allowed

255 °C

948626-1

10

100

1000

10000

0

100

200

300

0

50

100

150

200

250

TTW Soldering (according to CECC00802)

Time (s)

50

150

250

2 K/s

Second

wave

First wave

5 s

Full line: typical

Dotted lines:

process limits

Lead temperature

235 °C to

260 °C

100 °C to

130 °C

ca. 200 K/s

Forced cooling

ca. 5 K/s

ca. 2 K/s