2016. 9. 28

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FC9521

Revision No : 0

Input Capacitor

A 1μF ceramic bypass capacitor from VIN to GND, located

near the FC9521, is strongly recommended to suppress the

ringing during short circuit fault event. Without the bypass

capacitor, the output short may cause sufficient ringing on

the input (from supply lead inductance) to damage internal

control circuitry.

Output Capacitor

A low-ESR 10μF aluminum electroly�c or tantalum between

drop during hot-a�achment of downstream peripheral. (Per

USB 2.0, output ports must have a minimum 120μF of

low-ESR bulk capacitance per hub).

Higher-value output capacitor is be�er when the output load

is heavy. Addi�onally, bypassing the output with a 0.1μF

ceramic capacitor improves the immunity of the device to

short-circuit transients.

Layout Considera�on

The PCB layout should be carefully performed to maximize

thermal dissipa�on and to minimize voltage drop, droop and

EMI. The following guidelines must be considered:

1. Please place the input capacitors near the VIN pin as close

as possible.

2. Output decoupling capacitors for load must be placed near

the load as close as possible for decoupling high frequency

ripples.

3. Locate FC9521 and output capacitors near the load to

reduce parasi�c resistance and inductance for excellent load

transient performance.

4. The nega�ve pins of the input and output capacitors and

the GND pin must be connected to the ground plane of the

load.

Applica�on Informa�on