SFECV10M7GA00-R0 datasheet(45/57 Pages) MURATA

45 / 57 page

Please read CAUTION and Notice in this catalog for safety. This catalog has only typical specifications. Therefore you are requested

to approve our product specification or to transact the approval sheet for product specification, before your ordering.

P61E7.pdf 01.10.17

Chip Type Discriminators CDSCA Series Notice

s Notice (Soldering and Mounting)

1. Standard Reflow Soldering Condition

(1) Reflow

The component cannot be withstand washing.

2. Wash

Lead terminal is directly contacted with the tip of

soldering iron of +280

±5°C for 3.0 seconds±0.5 seconds.

(2) Soldering Iron

5 sec

Gradual

Cooling

150

240

260

Time (sec.)

s Notice (Handling)

1. The component mounted on the PCB may be damaged if

excess mechanical stress is applied.

2. Layout the components on the PCB to minimize the

stress imposed by the warp or flexure of the board.

3. After installing components, if solder is excessively

applied to the circuit board, mechanical stress will cause

destruction resistance characteristics to be lower. To

prevent this, be extremely careful in determining shape

and dimension before designing the circuit board diagram.

4. When the positioning claw or pick up nozzle are worn, the

excess load is applied to the components while

positioning or placing are performed. Careful checking

and maintenance are necessary to prevent unexpected

trouble.

5. When correcting component's position with a soldering

iron, the tip of the soldering iron should not directly touch

the chip component. Depending on the soldering

conditions, the effective area of terminations may be

reduced. The use of solder containing Ag should be

considerd to prevent the electrode erosion.

6. Do not clean or wash the component as it is not

hermetically sealed.

7. In case of overcoating the part, coating conditions such

as material, curing temperature, and so on must be

evaluated deeply.

8. Accurate test circuit values are required to measure

electrical characteristics.

It may be a cause of mis-correlation if there is any

deviation, especially stray capacitance, from the test

circuit in the specification.

[Component direction]

[Component layout close to board]

Put the

component

laterally to the

direction in

which stress

acts.

Susceptibility to

stress is in the order

of : A>C>B

Slit

Perforation

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