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S-8211CDD-M5T1U 数据表(PDF) 42 Page - ABLIC Inc. |
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S-8211CDD-M5T1U 数据表(HTML) 42 Page - ABLIC Inc. |
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42 / 43 page ![]() No. TITLE UNIT ANGLE ABLIC Inc. mm SNT-6A-A -Land Recommendation PG006-A-L-SD-4.1 No. PG006-A-L-SD-4.1 0.3 0.2 0.52 1.36 0.52 1 2 Caution 1. Do not do silkscreen printing and solder printing under the mold resin of the package. 2. The thickness of the solder resist on the wire pattern under the package should be 0.03 mm or less from the land pattern surface. 3. Match the mask aperture size and aperture position with the land pattern. 4. Refer to "SNT Package User's Guide" for details. 1. (0.25 mm min. / 0.30 mm typ.) 2. (1.30 mm ~ 1.40 mm) 0.03 mm SNT 1. Pay attention to the land pattern width (0.25 mm min. / 0.30 mm typ.). 2. Do not widen the land pattern to the center of the package ( 1.30 mm ~ 1.40 mm ). 1. 2. (1.30 mm ~ 1.40 mm) (0.25 mm min. / 0.30 mm typ.) |
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