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TMP6131DECR 数据表(PDF) 32 Page - Texas Instruments |
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TMP6131DECR 数据表(HTML) 32 Page - Texas Instruments |
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32 / 36 page ![]() www.ti.com EXAMPLE BOARD LAYOUT 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND (R0.05) TYP (0.65) 2X (0.5) 2X (0.25) 4224506/A 08/2018 X1SON - 0.5 mm max height DEC0002A PLASTIC SMALL OUTLINE - NO LEAD SYMM 1 2 SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:60X NOTES: (continued) 3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 4. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK DETAILS METAL EDGE SOLDER MASK OPENING EXPOSED METAL NON SOLDER MASK DEFINED METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METAL SOLDER MASK DEFINED (PREFERRED) |
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