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56F8167 数据表(PDF) 38 Page - Freescale Semiconductor, Inc |
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56F8167 数据表(HTML) 38 Page - Freescale Semiconductor, Inc |
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38 / 184 page ![]() 56F8367 Technical Data, Rev. 7.0 38 Freescale Semiconductor Preliminary EXTBOOT 124 B11 Schmitt Input Input, pull-up enabled External Boot — This input is tied to VDD to force the device to boot from off-chip memory (assuming that the on-chip Flash memory is not in a secure state). Otherwise, it is tied to ground. For details, see Table 4-4. Note: When this pin is tied low, the customer boot software should disable the internal pull-up resistor by setting the XBOOT bit of the SIM_PUDR; see Part 6.5.6. EMI_MODE 159 B2 Schmitt Input Input, pull-up enabled External Memory Mode — This input is tied to VDD in order to enable an extra four address lines, for a total of 20 address lines out of reset. This function is also affected by EXTBOOT and the Flash security mode. For details, see Table 4-4. If a 20-bit address bus is not desired, then this pin is tied to ground. Note: When this pin is tied low, the customer boot software should disable the internal pull-up resistor by setting the EMI_MODE bit of the SIM_PUDR; see Part 6.5.6. Table 2-2 Signal and Package Information for the 160-Pin LQFP and MBGA Signal Name Pin No. Ball No. Type State During Reset Signal Description |
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