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TPS16632RGER 数据表(PDF) 22 Page - Texas Instruments

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部件名 TPS16632RGER
功能描述  TPS1663x 60-V, 6-A eFuse with Adjustable Output Power Limiting
PDF  43 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

TPS16632RGER 数据表(HTML) 22 Page - Texas Instruments

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IMON
VIN
VOUT
IIN
22
TPS1663
SLVSET9D – SEPTEMBER 2018 – REVISED AUGUST 2019
www.ti.com
Product Folder Links: TPS1663
Submit Documentation Feedback
Copyright © 2018–2019, Texas Instruments Incorporated
Feature Description (continued)
Figure 26. IMON Response During a Load Step
The IMON pin must not have a bypass capacitor to avoid delay in the current monitoring information.
9.3.7 FAULT Response (FLT)
The FLT open-drain output asserts (active low) under the faults events such as undervoltage, overvoltage,
overload, power limiting, ILIM pin short and thermal shutdown conditions. The device is designed to eliminate
false reporting by using an internal "de-glitch" circuit for fault conditions without the need for an external circuitry.
FLT can be left open or connected to GND when not used.
9.3.8 Power Good Output (PGOOD)
The devices feature an open drain Power good (PGOOD) indicator output. PGOOD can be used for enable-
disable control of the downstream loads like DC-DC converters. PGOOD goes high when the internal FET’s gate
is enhanced. It goes low when the internal FET turns OFF during a fault event or when SHDN is pulled low.
There is a deglitch of 11.5 msec (typical), tPGOODR at the rising edge and 10 msec (typical), tPGOODF on falling
edge. PGOOD is a rated for 60 V and can be pulled to IN or OUT through a resistor.
9.3.9 IN, P_IN, OUT and GND Pins
Connect a minimum of 0.1-µF capacitor across IN and GND. Connect P_IN and IN together. Do not leave any of
the IN and OUT pins un-connected.
9.3.10 Thermal Shutdown
The device has a built-in overtemperature shutdown circuitry designed to protect the internal FET, if the junction
temperature exceeds T(TSD), 165°C (typical). After the thermal shutdown event, depending upon the mode of fault
response configured as shown inTable 1, the device either latches off or commences an auto-retry cycle of 648
msec (typical), t(TSD_retry) after TJ < [T(TSD) – 11°C]. During the thermal shutdown, the fault pin FLT pulls low to
indicate a fault condition.
9.3.11 Low Current Shutdown Control (SHDN)
The internal and the external FET and hence the load current can be switched off by pulling the SHDN pin below
0.8-V threshold with a micro-controller GPIO pin or can be controlled remotely with an opto-isolator device. The
device quiescent current reduces to 21 μA (typical) in shutdown state. To assert SHDN low, the pull down must
have sinking capability of at least 10 µA. To enable the device, SHDN must be pulled up to atleast 2 V. Once the
device is enabled, the internal FET turns on with dVdT mode.Figure 27 and Figure 28 illustrate the performance
of SHDN control.



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