eGaN® FET DATASHEET

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EPC2021

2021

YYYY

ZZZZ

Die orientation dot

Gate Pad bump is

under this corner

Part

Number

Laser Marking

Part #

Marking Line 1

Lot_Date Code

Marking Line 2

Lot_Date Code

Marking Line 3

EPC2021

2021

YYYY

ZZZZ

DIE MARKINGS

DIE OUTLINE

Solder Bump View

Side View

Seating plane

2

4

6

8

10

12

14

16

18

20

22

24

26

28

30

1

3

5

7

9

11

13

15

17

19

21

23

25

27

29

A

f

g

X4

e

X30

X28

Pad 1 is Gate;

Pads 2 ,5, 6, 9, 10, 13, 14, 17, 18, 21, 22,

25, 26, 29 are Source;

Pads 3, 4, 7, 8, 11, 12, 15, 16, 19, 20, 23,

24, 27, 28 are Drain;

*Substrate pin should be connected to Source

DIM

Micrometers

MIN

Nominal

MAX

A

6020

6050

6080

B

2270

2300

2330

c

2047

2050

2053

d

717

720

723

e

210

225

240

f

195

200

205

g

400

400

400

TAPE AND REEL CONFIGURATION

4 mm pitch, 12 mm wide tape on 7” reel

7” reel

a

d

e

f

g

c

b

Note 1: MSL 1 (moisture sensitivity level 1) classied according to IPC/JEDEC industry standard.

Note 2: Pocket position is relative to the sprocket hole measured as true position of the pocket,

not the pocket hole.

Die

orientation

dot

Gate

solder bar is

under this

corner

Die is placed into pocket

solder bar side down

(face side down)

Loaded Tape Feed Direction

Dimension (mm) target min max

a

12.00 11.70 12.30

b

1.75 1.65 1.85

c (note 2)

5.50 5.45 5.55

d

4.00 3.90 4.10

e

4.00 3.90 4.10

f (note 2)

2.00 1.95 2.05

g

1.5

1.5

1.6

EPC2021 (note 1)