02015K8R2ABSTR500 datasheet(22/25 Pages) AVX

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CAPACITOR TYPE

CHIP SIZE

THERMAL IMPEDANCE (°C/W)

Accu-P

0805

6.5

1210

Microwave MLC

0505

1210

7.5

ADVANTAGES OF ACCU-P

IN RF POWER CIRCUITS

The optimized design of Accu-P

® offers the designer of RF

power circuits the following advantages:

• Reduced power losses due to the inherently low ESR of

Accu-P

®.

• Increased power dissipation due to the high thermal

conductivity of Accu-P

®.

PRACTICAL APPLICATION

IN RF POWER CIRCUITS

• There is a wide variety of different experimental methods

for measuring the power handling performance of a

capacitor in RF power circuits. Each method has its

own problems and few of them exactly reproduce the

conditions present in “real” circuit applications.

• Similarly, there is a very wide range of different circuit appli-

cations, all with their unique characteristics and operating

conditions which cannot possibly be covered by such

“theoretical” testing.

• THE ONLY TRUE TEST OF A CAPACITOR IN ANY PARTICULAR

APPLICATION IS ITS PERFORMANCE UNDER OPERATING

CONDITIONS IN THE ACTUAL CIRCUIT.

Accu-P

Performance Characteristics RF Power Applications

RF POWER APPLICATIONS

In RF power applications capacitor losses generate heat. Two

factors of particular importance to designers are:

• Minimizing the generation of heat.

• Dissipating heat as efficiently as possible.

CAPACITOR HEATING

• The major source of heat generation in a capacitor in RF

power applications is a function of RF current (I) and ESR,

from the relationship:

Power dissipation = I

RMS x ESR

• Accu-P

capacitors are specially designed to minimize

ESR and therefore RF heating. Values of ESR for

Accu-P

capacitors are significantly less than those of

ceramic MLC components currently available.

HEAT DISSIPATION

• Heat is dissipated from a capacitor through a variety of

paths, but the key factor in the removal of heat is the

thermal conductivity of the capacitor material.

• The higher the thermal conductivity of the capacitor, the

more rapidly heat will be dissipated.

• The table below illustrates the importance of thermal

conductivity to the performance of Accu-P

in power

applications.

PRODUCT

MATERIAL

THERMAL CONDUCTIVITY W/mK

Accu-P

Alumina

18.9

Microwave MLC

Magnesium Titanate

6.0

Power Handling

Accu-P® 10pF

Data used in calculating the graph:

Thermal impedance of capacitors:

0402

17°C/W

0603

12°C/W

0805

6.5°C/W

1210

5°C/W

Thermal impedance measured using RF generator,

amplifier and strip-line transformer.

ESR of capacitors measured on Boonton 34A

THERMAL IMPEDANCE

Thermal impedance of Accu-P

® chips is shown below com-

pared with the thermal impedance of Microwave MLC’s.

The thermal impedance expresses the temperature difference

in °C between chip center and termination caused by

a power dissipation of 1 watt in the chip. It is expressed in

°C/W.

050118

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