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02015K8R2ABSTR500 数据表(PDF) 23 Page - AVX Corporation

部件名 02015K8R2ABSTR500
功能描述  Thin-Film Technology
PDF  25 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  AVX [AVX Corporation]
网页  http://www.avx.com
标志 AVX - AVX Corporation

02015K8R2ABSTR500 数据表(HTML) 23 Page - AVX Corporation

Back Button 02015K8R2ABSTR500 Datasheet HTML 17Page - AVX Corporation 02015K8R2ABSTR500 Datasheet HTML 18Page - AVX Corporation 02015K8R2ABSTR500 Datasheet HTML 19Page - AVX Corporation 02015K8R2ABSTR500 Datasheet HTML 20Page - AVX Corporation 02015K8R2ABSTR500 Datasheet HTML 21Page - AVX Corporation 02015K8R2ABSTR500 Datasheet HTML 22Page - AVX Corporation 02015K8R2ABSTR500 Datasheet HTML 23Page - AVX Corporation 02015K8R2ABSTR500 Datasheet HTML 24Page - AVX Corporation 02015K8R2ABSTR500 Datasheet HTML 25Page - AVX Corporation  
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1.7
(0.068)
0.55
(0.022)
0.5
(0.020)
0.6
(0.024)
0.6
(0.024)
3.0
(0.118)
1.25 (0.049)
1.0
(0.039)
0.17
(0.007)
0.20
(0.008)
0.22
(0.009)
0.78
(0.030)
0.34
(0.013)
0.26
(-0.010)
0.26
(-0.010)
0.26
(-0.010)
1.0
(0.039)
1.0
(0.039)
4.0
(0.157)
1.0
(0.039)
2.5 (0.098)
2.0
(0.079)
1.0
(0.039)
0.8 (0.031)
2.3
(0.091)
0.6
(0.024)
0.85
(0.033)
0.85
(0.033)
Accu-P
®
Application Notes
GENERAL
Accu-P
® SMD capacitors are designed for soldering to printed
circuit boards or other substrates. The construction of the
components is such that they will withstand the time/temper-
ature profiles used in both wave and reflow soldering meth-
ods.
CIRCUIT BOARD TYPE
The circuit board types which may be used with Accu-P
® are
as follows:
All flexible types of circuit boards
(eg. FR-4, G-10) and also alumina.
For other circuit board materials, please consult factory.
HANDLING
SMD capacitors should be handled with care to avoid damage
or contamination from perspiration and skin oils. The use of
plastic tipped tweezers or vacuum pick-ups is strongly recom-
mended for individual components. Bulk handling should
ensure that abrasion and mechanical shock are minimized. For
automatic equipment, taped and reeled product gives the
ideal medium for direct presentation to the placement
machine.
COMPONENT PAD DESIGN
Component pads must be designed to achieve good
joints and minimize component movement during reflow
soldering. Pad designs are given below for both wave and
reflow soldering.
The basis of these designs is:
a. Pad width equal to component width. It is permissible to
decrease this to as low as 85% of component width but
it is not advisable to go below this.
b. Pad overlap 0.5mm beneath large components. Pad
overlap about 0.3mm beneath small components.
c. Pad extension of 0.5mm for reflow of large components
and pad extension about 0.3mm for reflow of small com-
ponents. Pad extension about 1.0mm for wave soldering.
REFLOW SOLDERING
PAD DIMENSIONS: millimeters (inches)
0402
Accu-P
®
0201
Accu-P
®
01005
Accu-P
®
0603
Accu-P
®
0805
Accu-P
®
1210
Accu-P
®
28
050118



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