TFP503

PanelBus HDCP DIGITAL RECEIVER

SLDS149 − AUGUST 2004

22

POST OFFICE BOX 655303

Thermal Vias

5.8 mm SQ

Minimum

Figure 21. Recommended Thermal Land Size

More information on this package and other requirements for using thermal lands and thermal vias are detailed

in the TI application note PowerPAD Thermally Enhanced Package Application Report, TI literature number

SLMA002, available via the TI Web pages beginning at URL: http://www.ti.com

The following table outlines the thermal properties of the TI 100-terminal TQFP PowerPAD package.

Table 1. TI 100-Terminal TQFP (14

× 14 × 1 mm)/0.5-mm Lead Pitch

PARAMETER

PowerPAD

NOT CONNECTED TO

PCB THERMAL PLANE

PowerPAD

CONNECTED TO PCB

THERMAL PLANE

(see Note 15)

RθJA

Junction-to-ambient thermal resistance (see Notes 15, 16, 17, and 18)

73.7

°C/W

22.5

°C/W

PD

Package power dissipation (see Notes 15, 16, 17, and 18)

1.08 W

3.55 W

NOTES: 15. Specified with the PowerPAD bond pad on the backside of the package soldered to a 2 oz Cu plate PCB thermal plane.

16. Airflow is at 0 LFM (no airflow).

17. Specified at 150

°C junction temperature and 70°C ambient temperature.

18. It is recommended that the power pad of the device must be connected to the PCB thermal plane for improved thermal performance.