AHP201208FA-R33M datasheet(4/6 Pages) TAI-TECH

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Item

Performance

Test Condition

Bending

Appearance：No damage.

Inductance：within±10% of initial value

Q：Shall not exceed the specification value.

RDC：within ±15% of initial value and shall not

exceed the specification value

Shall be mounted on a FR4 substrate of the

following dimensions: >=0805 inch(2012mm):40x100x1.2mm

<0805 inch(2012mm):40x100x0.8mm

Bending depth: >=0805 inch(2012mm):1.2mm

<0805 inch(2012mm):0.8mm

duration of 10 sec.

Shock

Solder ability

More than 95% of the terminal electrode should

be covered with solder

。

Preheat: 150℃,60sec.

。

Solder: Sn96.5% Ag3% Cu0.5%

Temperature: 245±5℃。

Flux for lead free: Rosin. 9.5%。

Dip time: 4±1sec。

Depth: completely cover the termination

Resistance to Soldering Heat

Appearance：No damage.

Inductance：within±10% of initial value

Q：Shall not exceed the specification value.

RDC：within ±15% of initial value and shall not

exceed the specification value e

Depth: completely cover the termination

Terminal

Strength

Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC

J-STD-020DClassification Reflow Profiles

With the component mounted on a PCB with the device to be

tested, apply a force(>0805:1kg , <=0805:0.5kg)to the side of a

device being tested. This force shall be applied for 60 +1 seconds.

Also the force shall be applied gradually as not to apply a shock to

the component being tested.

Temperature(°C) Time(s)

Temperature

ramp/immersion

and emersion rate

Number of

heat cycles

260 ±5

(solder temp)

10 ±1

25mm/s ±6 mm/s

Type

Peak

value

(g’s)

Normal

duration (D)

(ms)

Wave

form

Velocity

change

(Vi)ft/sec

SMD

Half-sine

11.3

Lead

Half-sine

11.3

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