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AHP201208FA-R33M 数据表(PDF) 5 Page - TAI-TECH Advanced Electronics Co., Ltd. |
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AHP201208FA-R33M 数据表(HTML) 5 Page - TAI-TECH Advanced Electronics Co., Ltd. |
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5 / 6 page ![]() TAI-TECH www.tai-tech.com.tw P6 7. Soldering and Mounting 7-1. Soldering 7-1.1 Solder re-flow: 7-1.2 Soldering Iron(Figure 2): 7-2. Recommended PC Board Pattern Mildly activated rosin fluxes are preferred. TAI-TECH terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Recommended temperature profiles for re-flow soldering in Figure 1. Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150℃ ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧350℃ tip temperature (max) ‧1.0mm tip diameter (max) ‧Limit soldering time to 4~5 sec. Fig.1 L G L(mm) G(mm) H(mm) 2.3 0.8 1.5 |
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