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OPAX607

SBOS981B – OCTOBER 2019 – REVISED FEBRUARY 2020

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Copyright © 2019–2020, Texas Instruments Incorporated

12 Device and Documentation Support

12.1 Device Support

12.1.1 Development Support

Texas Instruments, precision lab videos

12.2 Documentation Support

12.2.1 Related Documentation

For related documentation see the following:

•

Texas Instruments, OPA2834 50-MHz, 170-μA, Negative-Rail In, Rail-to-Rail Out, Voltage-Feedback Amplifier

data sheet

•

Texas Instruments, ADS7042 Ultra-Low Power, Ultra-Small Size, 12-Bit, 1-MSPS, SAR ADC data sheet

•

Texas Instruments, Ultrasonic Sensing Subsystem Reference Design For Gas Flow Measurement design

guide

•

Texas Instruments, OPAx836 Very-Low-Power, Rail-to-Rail Out, Negative Rail In, Voltage-Feedback

Operational Amplifiers data sheet

•

Texas Instruments, Filter Design in Thirty Seconds application report

12.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

12.4 Community Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

12.5 Trademarks

TINA, E2E are trademarks of Texas Instruments.

Input Offset Drift: 1.5 μV/°C (maximum) is a trademark of others.

All other trademarks are the property of their respective owners.

12.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.