3312 - 2 mm SMD Trimming Potentiometer

3312 - 2 mm SMD Trimming Potentiometer

AVHT Series - High Temperature Automotive Grade Varistors

Specifications are subject to change without notice.

Users should verify actual device performance in their specific applications.

Soldering Recommendations for SMD Components (Continued)

Rework Criteria - Soldering Iron

Unless absolutely necessary, the use of soldering irons is NOT recommended for reworking varistor chips. If no other means of rework is

available, the following criteria must be strictly followed:

• Do not allow the tip of the iron to directly contact the top of the chip

• Do not exceed the following soldering iron specifications:

Output Power.......................................30 Watts Maximum

Temperature of Soldering Iron Tip.......280 °C Maximum

Soldering Time.....................................10 Seconds Maximum

Storage Conditions

SMD varistors should be used within 1 year of purchase to avoid possible soldering problems caused by oxidized terminals. The storage

environment should be controlled, with humidity less than 40 % and temperature between -25 and +45 °C. Varistor chips should always

be stored in their original packaged unit.

When varistor chips have been in storage for more than 1 year, and when there is evidence of solderability difficulties, Bourns can

“refresh” the terminations to eliminate these problems.

Solder Test and Retained Samples

Reflow soldering test based on J-STD-020D.1 and soldering test by dipping based on IEC 60068- 2 for Pb-free solders are performed on

each production lot as shown in the following chart. Test results and accompanying samples are retained for a minimum of two (2) years.

The solderability of a specific lot can be checked at any time within this period, should a customer require this information.

Test

Resistance to Flux

Solderability

Static Leaching (Simula-

tion of Reflow Soldering)

Dynamic Leaching (Simu-

lation of Wave Soldering)

Soldering method

Dipping

Dipping

Dipping

Dipping with Agitation

Flux

L3CN, ORL0

L3CN, ORL0, R

L3CN, ORL0, R

L3CN, ORL0, R

Pb Solder

62Sn / 36Pb / 2Ag

Pb Soldering

Temperature (°C)

235 ± 5

235 ± 5

260 ± 5

235 ± 5

Pb-Free Solder

Sn96 / Cu0,4-0,8 / 3-4Ag

Pb-Free Soldering

Temperature (°C)

250 ± 5

250 ± 5

280 ± 5

250 ± 5

Soldering Time (sec.)

2

210

10

> 15

Burn-in Conditions

-

-

-

Acceptance Criterion

unchanged

> 95 % of end termination

must be covered by solder

> 95 % of end termination

must be intact and

covered by solder

> 95 % of end termination

must be intact and

covered by solder