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STM32F3 数据表(PDF) 4 Page - STMicroelectronics |
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STM32F3 数据表(HTML) 4 Page - STMicroelectronics |
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4 / 16 page ![]() 4 STM32F3 key benefits MAIN FEATURES AND BENEFITS Features Benefits Performance and architecture • 72 MHz / 63 DMIPS (from Flash) or 90 DMIPS (from CCM‑SRAM) • ARM® Cortex®‑M4 with single cycle DSP MAC and floating point unit (FPU) • Routine Booster (CCM‑SRAM for Core Coupled Memory‑SRAM): SRAM mapped to the instruction bus • SRAM with parity bit • Memory Protection Unit (MPU) • Embedded Trace Macrocell (ETM) • Interconnect matrix • DMA controllers • Flexible Static Memory Controller (FSMC) • Boosted execution of control algorithms • Better code efficiency • Fast time to market • Elimination of scaling and saturation • More performance for critical routines with zero wait state execution from safe CCM‑SRAM • 100% deterministic execution from CCM‑SRAM • Data and code reliability • Advanced debug functions • Peripheral connection flexibility and code size reduction • Large set of external memory accessible up to 36 MHz giving more flexibility • No code size limit Outstanding power efficiency • Stop mode down to 6.7 μA (typ.) • RTC down to 0.5 μA (typ.) in V BAT mode • 2.0 to 3.6 V or 1.8 V ± 8% power supply range • Flexibility to reduce power consumption for applications requiring advanced analog peripherals and low‑power modes • Ideal for running at low voltages or on a rechargeable battery Superior and innovative peripherals • Analog: Fast 12‑bit ADC at 5 Msps (0.2 µs), Precise 16‑bit sigma‑delta ADC, Fast and ultra‑fast comparators (25 ns), Op amp with PGA (4 gains, 1% accuracy), 12‑bit DACs • Up to 18 timers: 16‑ and 32‑bit resolution running up to 144 MHz • Audio: Simplex or full duplex I²S interfaces • Large set of communication interfaces including USART (9 Mbit/s), SPI/I²S (18 Mbit/s), I²C (1 MHz fast mode plus), CAN (1 Mbit/s), and full‑speed USB • Cyclic redundancy check (CRC) • Capacitive touch sensing (24 keys) • High‑resolution timer (217 ps) with complex waveform builder and multi‑event handler • Mixed signal management within one chip • BOM cost reduction • Simpler PCB design • Reduced MCU layout footprint • Code reliability • Eases digital power conversion • Control loop STM32 compatibility and scalable portfolio • Pin compatibility and same API with STM32F0 peripherals • From 16 up to 512 Kbytes of Flash memory • From 32 to 144 pins in QFN, LQFP, BGA, and WLCSP packages • Ambient temperature range: –40 °C to +105 °C (+125 °C junction) • Eases platform development strategy from Cortex‑M0 (F0 series) up to Cortex‑M4 (F3 series) cores • Industrial grade |
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