MPX4100A

Sensors

Freescale Semiconductor

5

Pressure

On-chip Temperature Compensation and Calibration

chip carrier (Case 867). A fluorosilicone gel isolates the die

surface and wire bonds from the environment, while allowing

the pressure signal to be transmitted to the sensor

diaphragm. The MPX4100A series pressure sensor

operating characteristics, and internal reliability and

qualification tests are based on use of dry air as the pressure

media. Media, other than dry air, may have adverse effects on

sensor performance and long-term reliability. Contact the

factory for information regarding media compatibility in your

application.

interfacing the output of the integrated sensor to the A/D input

of a microprocessor or microcontroller. Proper decoupling of

the power supply is recommended.

pressure input. Typical, minimum, and maximum output

curves are shown for operation over a temperature range of

0

(The output will saturate outside of the specified pressure

range.)

Figure 2. Cross-Sectional Diagram (not to scale)

Figure 3. Recommended Power Supply Decoupling and Output Filtering

(For output filtering recommendations, refer to Application Note AN1646.)

Figure 4. Output versus Absolute Pressure

Absolute Element

P2

Lead Frame

Wire Bond

Fluoro Silicone

Gel Die Coat

Bond

Die

Epoxy Plastic

Case

Stainless Steel

Metal Cover

+5 V

1.0 μF

0.01 μF

470 pF

GND

IPS

Output

Transfer Function:

VS = 5.1 Vdc

Pressure (ref. to sealed vacuum) in kPa

MAX

TYP

MIN

5.0

4.5

3.5

4.0

3.0

2.5

2.0

1.5

1.0

0

0.5

TEMP = 0 to 85°C

20 kPa to 105 kPa

MPX4100A