MPX4100A

Sensors

Freescale Semiconductor

7

Pressure

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

The two sides of the pressure sensor are designated as

the Pressure (P1) side and the Vacuum (P2) side. The

Pressure (P1) side is the side containing fluorosilicone gel,

which protects the die from harsh media. The MPX pressure

sensor is designed to operate with positive differential

pressure applied, P1 > P2.

The Pressure (P1) side may be identified by using the

following table:

INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the surface mount packages must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct

footprint, the packages will self align when subjected to a

solder reflow process. It is always recommended to design

boards with a solder mask layer to avoid bridging and

shorting between solder pads.

Figure 5. SOP Footprint (Case 482)

Part Number

Case Type

Pressure (P1) Side Identifier

MPX4100A

867

Stainless Steel Cap

MPX4100AP

867B

Side with Part Marking

MPX4100AS

867E

Side with Port Attached

MPXAZ4100A6U, MPXA4100A6U/TI

482

Side with Part Marking

MPXAZ4100AC6U, MPXA4100AC6U

482A

Side with Port Attached

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

0.100 TYP 8X

2.54

0.300

7.62

inch

mm

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