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FPD2000V 数据表(PDF) 1 Page - Filtronic Compound Semiconductors |
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FPD2000V 数据表(HTML) 1 Page - Filtronic Compound Semiconductors |
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1 / 3 page ![]() PRELIMINARY FPD2000V 2W POWER PHEMT Phone: +1 408 850-5790 http://www.filtronic.co.uk/semis Revised: 4/29/05 Fax: +1 408 850-5766 Email: sales@filcsi.com • PERFORMANCE (1.8 GHz) ♦ 33 dBm Linear Output Power ♦ 14.5 dB Power Gain ♦ Useable Gain to 10 GHz ♦ 44 dBm Output IP3 ♦ 20 dB Maximum Stable Gain ♦ 45% Power-Added Efficiency ♦ 10V Operation / Plated Source Thru-Vias • DESCRIPTION AND APPLICATIONS The FPD2000V is a discrete depletion mode AlGaAs/InGaAs pseudomorphic High Electron Mobility Transistor (pHEMT), optimized for power applications in L- and C-Bands. The FPD2000V includes Source plated thru-vias, and does not require wire bonds to the Source. Typical applications include drivers or output stages in PCS/Cellular base station transmitter amplifiers, as well as other power applications in WLL/WLAN amplifiers. • ELECTRICAL SPECIFICATIONS AT 22°C Parameter Symbol Test Conditions Min Typ Max Units RF SPECIFICATIONS MEASURED AT f = 1.8 GHz USING CW SIGNAL Power at 1dB Gain Compression P1dB VDS = 10V; IDS = 350 mA ΓS and ΓL tuned for Optimum IP3 32 33 dBm Power Gain at dB Gain Compression G1dB VDS = 10V; IDS = 350 mA ΓS and ΓL tuned for Optimum IP3 13.0 14.5 Maximum Stable Gain S21/S12 MSG VDS = 10 V; IDS = 350mA PIN = 0dBm, 50Ω system 20 dB Power-Added Efficiency at 1dB Gain Compression PAE VDS = 10V; IDS = 350 mA ΓS and ΓL tuned for Optimum IP3 45 % 3rd-Order Intermodulation Distortion ΓS and ΓL tuned for Optimum IP3 IM3 VDS = 10V; IDS = 350 mA POUT = 22 dBm (single-tone level) -46 dBc Saturated Drain-Source Current IDSS VDS = 1.3 V; VGS = 0 V 975 1150 1375 mA Maximum Drain-Source Current IMAX VDS = 1.3 V; VGS ≅ +1 V 1800 mA Transconductance GM VDS = 1.3 V; VGS = 0 V 1200 mS Gate-Source Leakage Current IGSO VGS = -3 V 35 85 µA Pinch-Off Voltage |VP| VDS = 1.3 V; IDS = 4 mA 0.7 0.9 1.4 V Gate-Source Breakdown Voltage |VBDGS| IGS = 4 mA 6 8 V Gate-Drain Breakdown Voltage |VBDGD| IGD = 4 mA 20 22 V Thermal Resistivity ΘCC See Note on following page 18 °C/W DRAIN BOND PAD (2X) GATE BOND PAD (2X) DIE SIZE ( µm): 650 x 800 DIE THICKNESS: 75 µm BONDING PADS ( µm): >70 x 70 |
类似零件编号 - FPD2000V |
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类似说明 - FPD2000V |
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