FPD2000V datasheet(2/3 Pages) FILTRONIC

2 / 3 page

PRELIMINARY

FPD2000V

2W POWER PHEMT

Phone: +1 408 850-5790

http://www.filtronic.co.uk/semis

Revised: 4/29/05

Fax: +1 408 850-5766

Email: sales@filcsi.com

•

RECOMMENDED OPERATING BIAS CONDITIONS

Drain-Source Voltage:

From 5V to 10V

Quiescent Current:

From 25% IDSS to 55% IDSS

•

ABSOLUTE MAXIMUM RATINGS1

Parameter

Symbol

Test Conditions

Min

Max

Units

Drain-Source Voltage

VDS

-3V < VGS < +0V

Gate-Source Voltage

VGS

0V < VDS < +8V

-3

Drain-Source Current

IDS

For VDS > 2V

IDSS

Gate Current

Forward or reverse current

+15/-2

RF Input Power2

Under any acceptable bias state

900

Channel Operating Temperature

TCH

Under any acceptable bias state

175

ºC

Storage Temperature

TSTG

Non-Operating Storage

-40

150

ºC

Total Power Dissipation

PTOT

See De-Rating Note below

8.5

Gain Compression

Comp.

Under any bias conditions

Simultaneous Combination of Limits3

2 or more Max. Limits

1TAmbient = 22°C unless otherwise noted

2Max. RF Input Limit must be further limited if input VSWR > 2.5:1

3Users should avoid exceeding 80% of 2 or more Limits simultaneously

Notes:

•

Operating conditions that exceed the Absolute Maximum Ratings could result in permanent damage to the device.

•

Thermal Resitivity specification assumes a Au/Sn eutectic die attach onto a Au-plated copper heatsink or rib.

•

Power Dissipation defined as: PTOT ≡ (PDC + PIN) – POUT, where

PDC: DC Bias Power

PIN: RF Input Power

POUT: RF Output Power

•

Absolute Maximum Power Dissipation to be de-rated as follows above 22

°C:

PTOT= 8.5W – (0.056W/°C) x THS

where THS = heatsink or ambient temperature above 22°C

Example: For a 85

°C heatsink temperature: PTOT = 8.5W – (0.056 x (85 – 22)) = 4.9W

•

HANDLING PRECAUTIONS

To avoid damage to the devices care should be exercised during handling. Proper Electrostatic

Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and

testing. This product has be tested to Class 1A (> 250V but < 500V) using JESD22 A114, Human

Body Model, and to Class A, (< 200V) using JESD22 A115, Machine Model..

•

ASSEMBLY INSTRUCTIONS

The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere.

Stage

temperature should be 280-290

°C; maximum time at temperature is one minute. The recommended

wire bond method is thermo-compression wedge bonding with 1.0 mil (0.025 mm) gold wire. Stage

temperature should be 250-260

°C.

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