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M41T00S

MAXIMUM RATING

Stressing the device above the rating listed in the

“Absolute Maximum Ratings” table may cause

permanent damage to the device. These are

stress ratings only and operation of the device at

these or any other conditions above those indicat-

ed in the Operating sections of this specification is

not implied. Exposure to Absolute Maximum Rat-

ing conditions for extended periods may affect de-

vice

reliability.

Refer

also

to

the

STMicroelectronics SURE Program and other rel-

evant quality documents.

Table 4. Absolute Maximum Ratings

Note: 1. For SO8 package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 260°C (total thermal budget not to exceed 245°C

for greater than 30 seconds).

2. For SO8 package, standard (SnPb) lead finish: Reflow at peak temperature of 240°C (total thermal budget not to exceed 180°C for

between 90 to 150 seconds).

3. The SOX18 package has Lead-free (Pb-free) lead finish, but cannot be exposed to peak reflow temperature in excess of 240°C

(use same reflow profile as standard (SnPb) lead finish).

CAUTION: Negative undershoots below –0.3 volts are not allowed on any pin while in the Battery Back-up Mode

Sym

Parameter

Value

Unit

SOIC

–55 to 125

°C

Supply Voltage

–0.3 to 7

V

Lead Solder Temperature for 10 Seconds

260

°C

Standard (SnPb)

240

°C

Input or Output Voltages

–0.3 to Vcc+0.3

V

Output Current

20

mA

Power Dissipation

1

W