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September 2017

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PI3DPX1202A

Document number: DS40115 Rev.2-1

6.2

PCB Layout Guideline

As transmission data rate increases rapidly, any flaws and/or mis-matches on PCB layout are amplified in terms of signal integrity.

Layout guideline for high-speed transmission is highlighted in this application note.

AC coupling Capacitor

Below is an example of placing AC coupling capacitors on high-speed channels.

Location

To wisely use the equalization selections offered by PI3DPX1202, it is recommended to place PI3DPX1202 at the end of the entire

path. In short, PI3DPX1202 should be located close to the output DP connector in a source application. Below is the PI3DPX1202

placement on its evaluation board.

Thermal Pad GND Via Recommendation

To wisely use the equalization selections offered by PI3DPX1202, it is recommended to place PI3DPX1202 at the end of the entire

path. In short, PI3DPX1202 should be located close to the output DP connector in a source application. Below is the PI3DPX1202

placement on its evaluation board .

Several GND vias are the “must” requirement in thermal pad. The recommended Via size is 12/24 mil.