HS300x Datasheet

© 2020 Renesas Electronics Corporation

17

April 22, 2020

11. PCB Layout Guide

When designing the PCB, undesired heat transfer paths to the HS300x series must be minimized. Excessive heat from other components on

the PCB will result in inaccurate temperature and relative humidity measurements. As such, solid metal planes for power supplies should

be avoided in the vicinity of the sensor since these will act as thermal conductors. To further reduce the heat transfer from other components

on the board, openings can be milled into the PCB as shown in Figure 22.

Figure 22. Milled PCB Openings for Thermal Isolation

12. Storage and Handling

Recommendation: Once the sensors are removed from their original packaging, store them in metal-in antistatic bags.

Avoid using polyethylene antistatic bags as they may affect sensor accuracy.

The nominal storage conditions are 10 to 50°C and humidity levels within 20% to 60%RH. If stored outside of these conditions for extended

periods of time, the sensor readings may exhibit an offset. The sensor can be reconditioned and brought back to its calibration state by applying

the following procedure:

1. Bake at a temperature of 100°C with a humidity < 10%RH for 10 to 12 hours.

2. Rehydrate the sensor at a humidity of 75%RH and a temperature between 20 to 30°C for 12 to 14 hours.

13.

Quality and Reliability

The HS300x series is available as a qualified product for consumer and industrial market applications. All data specified parameters are

guaranteed if not stated otherwise.