MCP2517FD datasheet(89/98 Pages) MICROCHIP

89 / 98 page

 2017-2018 Microchip Technology Inc.

DS20005688B-page 89

MCP2517FD

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Optional Center Pad Length

Contact Pitch

4.25

1.65

MILLIMETERS

0.65 BSC

MIN

MAX

Contact Pad Length (X14)

Contact Pad Width (X14)

0.85

0.35

Microchip Technology Drawing C04-3198A

NOM

Contact Pad Spacing

3.00

Contact Pad to Center Pad (X14)

0.25

Thermal Via Diameter

Thermal Via Pitch

0.30

1.00

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during

reflow process

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

ØV

SILK SCREEN

14-Lead Very Thin Plastic Quad Flat, No Lead Package (JHA) - 4.5x3.0 mm Body

[VDFN] With Dimpled Wettable Flanks

Spacing Between Contacts (X12)

0.30

MCP2517FD 数据表(PDF) 89 Page - Microchip Technology

MCP2517FD 数据表(HTML) 89 Page - Microchip Technology

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