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MXT1664T3-ABESSQTP 数据表(PDF) 84 Page - Microchip Technology |
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MXT1664T3-ABESSQTP 数据表(HTML) 84 Page - Microchip Technology |
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84 / 98 page ![]() MXT1664T3 2.0 DS40002054A-page 84 2018 Microchip Technology Inc. 14.16 Soldering Profile 14.17 Moisture Sensitivity Level (MSL) Profile Feature Green Package Average Ramp-up Rate (217 C to Peak) 3 C/s max Preheat Temperature 175 C ±25C 150 – 200 C Time Maintained Above 217 C 60 – 150 s Time within 5 C of Actual Peak Temperature 30 s Peak Temperature Range 260 C Ramp down Rate 6 C/s max Time 25 C to Peak Temperature 8 minutes max MSL Rating Package Type(s) Peak Body Temperature Specifications MSL3 BGA 260oC IPC/JEDEC J-STD-020 |
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