MXT1664T3-ABESSQTP datasheet(92/98 Pages) MICROCHIP

92 / 98 page

MXT1664T3 2.0

DS40002054A-page 92

 2018 Microchip Technology Inc.

Microchip Internet Web Site ........................................................ 95

Microsoft Windows compliance

HID-I2C communications..................................................... 48

Moisture sensitivity level (msl) .................................................... 84

Multiple function pins................................................................... 23

Mutual capacitance measurements ............................................ 16

Noise suppression....................................................................... 30

display ................................................................................. 30

Object-based protocol ................................................................. 68

Operational modes...................................................................... 29

Overview of the mXT1664T3 ...................................................... 16

PCB cleanliness .......................................................................... 60

PCB design ................................................................................. 60

analog I/O............................................................................ 62

component placement and tracking .................................... 62

crystal oscillator................................................................... 62

decoupling capacitors ......................................................... 60

digital signals....................................................................... 62

EMC problems .................................................................... 62

ground tracking ................................................................... 60

PCB cleanliness .................................................................. 60

power supply ....................................................................... 60

supply rails .......................................................................... 60

voltage regulator ................................................................. 61

Pinouts .......................................................................................... 3

136-ball UFBGA .................................................................... 3

162-ball UFBGA .................................................................... 8

Power control with HID-I2C communications .............................. 48

Power supply

I/O pins................................................................................ 21

PCB design ......................................................................... 60

Power supply ripple and noise .................................................... 70

Power-up/reset............................................................................ 26

Initialization ......................................................................... 28

power-on reset (POR) ......................................................... 26

VddIO enabled after Vdd..................................................... 27

Pull-up resistors .......................................................................... 21

Recommended operating conditions........................................... 69

Repeatability ............................................................................... 83

Report IDs

HID-I2C communications..................................................... 40

USB communications.......................................................... 50

Reset timings ............................................................................. 81

Retransmission compensation .................................................... 30

Schematic ................................................................................... 17

decoupling capacitors ......................................................... 21

GPIO pins............................................................................ 23

I2C interface ........................................................................ 21

pull-up resistors................................................................... 21

voltage booster.................................................................... 21

SCL line................................................................................. 38, 48

SCLline.................................................................................. 21, 38

Screen size ................................................................................. 25

SDA line .......................................................................... 21, 38, 48

Self capacitance measurements ................................................. 16

Self test........................................................................................68

Sensor acquisition .......................................................................29

Shieldless support .......................................................................30

Soldering profile...........................................................................84

Specifications.........................................................................69–84

absolute maximum specifications ........................................69

analog voltage supply ..........................................................70

DC characteristics ...............................................................70

digital voltage supply ...........................................................70

ESD information ..................................................................83

HID-I2C specification ...........................................................82

I2C specification...................................................................82

input/output characteristics ..................................................82

junction temperature ............................................................83

moisture sensitivity level (msl) .............................................84

power supply ripple and noise .............................................70

recommended operating conditions ....................................69

repeatability .........................................................................83

reset timings .......................................................................81

soldering profile ...................................................................84

test configuration .................................................................71

thermal data.........................................................................83

timing specifications ............................................................80

touch accuracy ....................................................................83

touchscreen sensor characteristics .....................................81

USB specification ................................................................82

XVdd voltage supply ............................................................70

SPI Debug Interface ..............................................................23, 68

Stylus support ..............................................................................31

Suggested component suppliers .................................................22

Supply rails ..................................................................................60

TCL. See Top-level collection

Test configuration specification ...................................................71

Thermal data................................................................................83

Timing specifications ...................................................................80

Top-level collection ......................................................................40

digitizer HID-I2C. See Digitizer HID-I2C top-level collection

generic HID-I2C. See Generic HID-I2C top-level collection .41

Touch accuracy ...........................................................................83

Touch detection .....................................................................16, 29

Touchscreen sensor characteristics ............................................81

Tuning..........................................................................................68

Unintentional touch suppression..................................................31

USB communications ............................................................49–59

composite device .................................................................49

digitizer HID. See Digitizer HID USB interface

endpoint addresses .............................................................49

generic HID. See Generic HID USB interface

report IDs .............................................................................50

specification ...................................................................49, 82

system remote wakeup event ..............................................59

system suspend event .........................................................59

system wakeup event ..........................................................59

USB suspend mode.............................................................59

USB debug interface....................................................................68

USB interface

digitizer HID. See Digitizer HID USB interface

generic HID. See Generic HID USB interface

Vdd voltage supply ......................................................................70

VddCore supply ...........................................................................23

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